Interconnect arrangement and associated production methods

ABSTRACT

An interconnect arrangement and fabrication method are described. The interconnect arrangement includes an electrically conductive mount substrate, a dielectric layer formed on the mount substrate, and an electrically conductive interconnect formed on the dielectric layer. At least a portion of the dielectric layer under the interconnect contains a cavity. To fabricate the interconnect arrangement, a sacrificial layer is formed on the mount substrate and the interconnect layer is formed on the sacrificial layer. The interconnect layer and the sacrificial layer are structured to produce a structured interconnect on the structured sacrificial layer. A porous dielectric layer is formed on a surface of the mount substrate and of the structured interconnect as well as the sacrificial layer. The sacrificial layer is then removed to form the cavity under the interconnect.

PRIORITY CLAIM

This application claims priority to German Patent Application DE 10 2005008 476.1, filed on Feb. 24, 2005, which is incorporated by reference intheir entirety.

TECHNICAL FIELD

The present invention relates to an interconnect arrangement and toassociated production methods, and in particular to an interconnectarrangement with improved electrical characteristics as can be used as abit line in a DRAM memory cell.

BACKGROUND

In semiconductor technology, interconnect arrangements are used to formwiring for semiconductor components. In this case, a dielectric layer orinsulating layer is normally formed on an electrically conductive mountsubstrate, such as a semiconductor substrate, and an electricallyconductive interconnect layer is formed on this dielectric layer, withthe interconnect layer representing the final interconnect, afterstructuring. Further insulating layers and electrically conductivelayers are then formed successively, thus resulting in a layer stackwhich allows even complex wiring structures.

The electrical characteristics of the interconnect arrangement in thiscase depend primarily on the materials used and in particular on theelectrical conductivity of the interconnects, as well on parasiticcapacitances per area section or length section of the interconnect.

Particularly in semiconductor memory cells such as DRAM memory cells,stored information is transported via a bit line to an evaluationcircuit. FIG. 12 shows a simplified equivalent circuit of a conventionalDRAM memory cell in which a storage capacitor CS is connected via aselection transistor AT to a bit line BL. The storage capacitor CS canbe a trench capacitor or an MIM (metal-insulator-metal) capacitor. Theselection transistor AT can be actuated via a word line WL such that thecharge or information stored in the storage capacitor CS can be read viathe bit line BL. The electrical characteristics of the bit line aredetermined primarily by their length 1 and the conductivity per unitlength, and the parasitic capacitance CP per unit length and/or unitarea. As shown in FIG. 12, the parasitic capacitance CP is charged anddischarged with the charge stored in the storage capacitor CS of thememory cell. To attenuate the original signal as little as possible, theparasitic capacitance of the bit line as well as a parasitic lineresistance (which is not illustrated) is minimized. To achieve thisminimization, the length of the bit lines is optimized.

U.S. Pat. No. 5,461,003 filed on May 27, 1994 and issued on Oct. 24,1995 discloses an interconnect arrangement in which air gaps ornon-conductive gases or a vacuum are/is used to reduce the capacitivecoupling between adjacent interconnects. In this case, a porousdielectric covering layer was used for the removal of a sacrificiallayer used for the air gap, while at the same time ensuring sufficientmechanical robustness. However, further improvements in the electricalcharacteristics are obtained.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention is illustrated by way of example and not limitedto the accompanying figures in which like references indicate similarelements. Exemplary embodiments will be explained in the following textwith reference to the attached drawings, in which:

FIGS. 1A-1C to FIGS. 5A-5C show simplified section views and plan viewsto illustrate fabrication of an interconnect arrangement according to afirst exemplary embodiment;

FIGS. 6A-6C to FIGS. 10A-10B show simplified section views and planviews to illustrate fabrication of an interconnect arrangement accordingto a second exemplary embodiment; and

FIG. 11 shows a simplified plan view of an interconnect arrangementaccording to a third exemplary embodiment.

Skilled artisans appreciate that elements in the figures are illustratedfor simplicity and clarity and have not necessarily been drawn to scale.

DETAILED DESCRIPTION

An interconnect arrangement and method are disclosed in which a cavityis located at least underneath the interconnect and thus between theinterconnect and the mount substrate. This makes it possible to reduceparasitic interconnect/substrate capacitances in semiconductorcomponents such as semiconductor memory cells. The cavity may be boundedby a porous dielectric layer, which at the same time adheres to theinterconnect and thus holds it, thus preventing the interconnect fromfalling or dropping down onto the mount substrate. Alternatively, thismounting option, which may be regarded as suspension of theinterconnects, can also be provided by means of a supporting structure.In this case, the dielectric supporting elements, which support theinterconnect from underneath, are formed in the cavity.

The interconnect may have a contact via and/or a dummy contact via whichlead/leads from the interconnect to the substrate surface and eithermakes or make electrical contact with or connects or connect to thesubstrate, or else touch or touches it and are or is not electricallyconnected to it. Contacts and/or additionally inserted dummy contactswhich are present may be used as further supporting structures for theinterconnect, thus reliably preventing the interconnect from fallingdown onto the mount substrate and a short-circuit being formed betweenthe interconnect and the mount substrate.

The interconnect may have a barrier layer to prevent interconnectmaterial from diffusing into the mount substrate. In a similar way, aresidual decomposition layer can also be formed in the cavity on thesurface of the mount substrate, which can be used in the same way as thebarrier layer and is produced, as a byproduct during removal of thesacrificial layer for the cavity.

With regard to the production method, a sacrificial layer is formed onan electrically conductive mount substrate to provide suspension for theinterconnects, an interconnect layer is formed on the sacrificial layer,and is structured together with the sacrificial layer. A porousdielectric layer is then formed over the entire surface, and thesacrificial layer is removed to form a cavity underneath theinterconnect. This method makes it possible to also produce cavitiesunderneath the interconnects.

A polymer which is thermally stabilized up to about 300-400 degreesCelsius is applied as the sacrificial layer, with thermal conversionbeing carried out at temperatures from 300 to 600 degrees Celsius forremoval of the sacrificial layer allowing the gaseous decompositionproducts created to escape through the porous layer.

With regard to the alternative production method for provision of asupport for interconnects, supporting structures are formed on a mountsubstrate, a sacrificial layer is then formed over the entire surfaceand is planarized as far as the surface of the supporting structure toform an interconnect layer on the planarized surface, and to structureit. Finally, the sacrificial layer is removed to form a cavity at leastunderneath the interconnect, and a closed dielectric covering layer isformed above the interconnects. In consequence, in this alternative, theinterconnects are not mounted or suspended from above but are supportedfrom underneath by means of a large number of supporting elements orpillars. The supporting elements may be arranged in straight lines oressentially at right angles to the interconnect, or may containindividual islands over which the interconnects pass.

Turning to the figures, FIGS. 1A to 5C show simplified section views andplan views that illustrate method steps in the production of aninterconnect arrangement according to a first exemplary embodiment. Inthis embodiment, the interconnects are held from above or at the sidesby suspension. Each of the FIGS. C show plan views, with FIGS. A and Beach showing the associated section views along a section A-A and B-Bfrom the associated FIG. C.

According to FIGS. 1A to 1C, a sacrificial layer 2 is formed on a mountsubstrate 1 which, for example, represents a semiconductor substrate.The semiconductor substrate can be formed from, for example,monocrystalline silicon. The sacrificial layer 2 may have openings 0that extend as far as the mount substrate 1 to provide subsequentcontacts. By way of example, a material which is thermally stable up toabout 300-400 degrees Celsius (e.g. a polymer) may be applied as thesacrificial layer 2. Polyamides such as Parylene or Teflon may be usedfor this high-temperature-resistant polymer. These polyamides may be,for example, centrifuged on or deposited by CVD.

As can be seen from FIGS. 2A to 2C, an optional barrier layer 3 can thenbe formed on the surface of the sacrificial layer 2 and/or within theopening O and on the surface of the mount substrate 1 as well, toprevent interconnect material that will be formed later from diffusinginto the mount substrate 1. By way of example, a TiN layer can bedeposited for the optional barrier layer 3 by means of a sputteringmethod such as PVD (physical vapor deposition). If a barrier layer suchas this has been formed, an interconnect layer 4 is then formed over theentire surface, that is to say either directly on the structuredsacrificial layer 2 or on the barrier layer 3. By way of example, atungsten CVD (chemical vapor deposition) method can be used to form anelectrically conductive tungsten layer 4, which at the same time alsoprovides a contact via to the mount substrate within the opening O. Inmetal deposition such as this, the sacrificial layer 2 may have goodtemperature stability up to at least 300 degrees Celsius. Polyimide,which is thermally stable up to about 450 degrees Celsius, is thussuitable for the sacrificial layer 2.

Alternative methods for formation of the interconnect layer or of theinterconnects, such as electroplating methods, are also feasible. Inthis case, by way of example, a barrier layer is first of all formed onthe surface of the sacrificial layer 2 by means of a sputtering method.A plug that is composed of copper, for example, is then produced as acontact via V electrochemically in the opening O. An aluminum layer isthen deposited over the entire surface, for example by means of a PVDmethod, and is structured. For a PVD/electrochemical method such asthis, the thermal stability of the sacrificial layer 2 can beconsiderably less stringent so that it is also possible to use materialswhich are thermally stable up to only 100 degrees Celsius for thesacrificial layer 2.

As shown in FIGS. 3A to 3C, the interconnect layer which comprises thebarrier layer 3 and the tungsten layer 4 is structured together with thesacrificial layer 2 in a subsequent step, thus resulting in the actualshape and structure of the interconnect. Isotropic etching (RIE,reactive ion etching) can be used. In this case, both single-step andtwo-step etching processes may be used. In two-step etching processes,the same ion etching process may be used for the sacrificial layer 2 asfor the formation of the opening O in FIG. 1A. This results in theinterconnects being straight lines or strips as illustrated in FIG. 3,with the sacrificial layer 2 remaining only underneath theinterconnects, and with the material otherwise being completely removedas far as the surface of the mount substrate 1. The contact vias V may,of course, be located at points which are covered by the interconnects.The width of the contact vias V may be less than the width of theinterconnects.

Although a subtractive structuring method for structuring of theinterconnects has been proposed above, the interconnects can also beproduced in the same way by means of a damascene or dual damasceneprocess. In this case, respective interconnect depressions or channelsare formed in addition to the sacrificial layer 2 in an SiO₂ layer,which is not illustrated but is located on the surface of thesacrificial layer, and depressions or channels are then filled withinterconnect material, and planarized. Thin barrier and seed layers maybe deposited by means of a PVD method, with a copper layer being thendeposited by means of an ECD (electrochemical deposition) method, andbeing planarized by means of a CMP method. Once the SiO₂ layer has beenetched away and the polymer layer has been structured, during whichprocess a metal web is used as a mask, this results in the samestructure as in FIGS. 3A to 3C.

As shown in FIGS. 4A to 4C, a porous dielectric layer 5A is formed onthe surface of the mount substrate 1 and of the structured sacrificiallayer 2, as well as the interconnect comprising the layer 4 and theoptional barrier layer 3. The porous dielectric is deposited, completelyfills the gaps between the interconnects and at the same time reliablycovers the interconnects. The characteristics of this porous dielectricmay be chosen such that a good adhesion capability is provided with theinterconnect, for example the tungsten layer 4 and the barrier layer 3,to allow an adequate adhesion force for the interconnect during thesubsequent removal of the sacrificial layer 2.

Porous SiO₂ may be deposited over the entire surface as the porousdielectric layer, although silicon-dioxide based xerogels can also becentrifuged on, by means of spin-on methods. The pores or openings inthis porous dielectric layer 5A may be of such a size that thedecomposition products can be reliably dissipated during a subsequentdecomposition step.

As shown in FIGS. 5A to 5C, the sacrificial layer 2 is now removed toform a cavity 6 underneath the interconnect or the barrier layer 3. Inthis case, thermal conversion may be carried out on the sacrificiallayer 2, with the gaseous decomposition products of the sacrificiallayer 2 escaping through the porous layer 5A, and thus creating an airgap or the cavity 6. When polyimide is used as the sacrificial layer 2,the entire layer stack is heated to a temperature of more than 450degrees Celsius, thus resulting in the polymer or the sacrificial layer2 being burnt away, and the combustion gases escaping through the porousdielectric 5A. If temperature step exceeds 600 degrees Celsius, however,in producing semiconductor circuits, doped junctions (pn) formed in thesemiconductor material can be damaged. If other materials are used asthe sacrificial layer 2, heat treatment may even be sufficient in atemperature range from 300 to 600 degrees Celsius. The surroundingatmosphere may be air or pure oxygen, for example.

Alternatively, the sacrificial layer 2 can also be dissolved by means ofan acid plasma or hydrogen plasma, and can be dissipated via the poresof the porous dielectric 5A. The air gap or cavity 6 that is createdunderneath the interconnect does not present any problems since themechanical robustness is sufficiently ensured by the adhesion or holdingforces of the porous layer 5A which is in contact at the sides and onthe surface of the interconnect. This results in a dielectric for theparasitic area capacitance between the interconnect and the substrate 1.

Furthermore, during this chemical conversion of the sacrificial layer 2into gaseous decomposition products, solid residual decompositionproducts are also deposited or precipitated on the surface of the mountsubstrate 1 within the cavity 6 as a residual decomposition layer 7. Inthis case, if suitable materials are used, a diffusion barrier layer canbe produced automatically to protect the mount substrate 1 and, forexample, a semiconductor substrate. The electrical characteristics ofthe semiconductor circuit thus remain uninfluenced, while the electricalcharacteristics of the interconnect are considerably improved, e.g. withrespect to the parasitic capacitance.

When a bit line BL as is illustrated in FIG. 12 is provided, DRAM memorycells can be provided which have greatly improved electricalcharacteristics in which the size of the storage capacitors CS can beconsiderably reduced. The integration density is thus considerablyincreased.

FIGS. 6A to 10D show simplified section views and plan views in order toillustrate method steps in the production of an interconnect arrangementaccording to a second exemplary embodiment, with provision being madefor the interconnect to be supported essentially from underneath.

Although in the first exemplary embodiment described above, it has beenpossible to considerably improve the parasitic capacitances formedbetween the interconnects and the electrically conductive mountsubstrate 1, undesirable parasitic capacitances can still be observed.This results from the areas which are located obliquely underneath theinterconnect. Parasitic capacitances such as these which are located atan angle to the interconnect downwards towards the mount substrate 1have the porous layer 5A as the dielectric. The dielectric constant isapproximately k=3.9 when using silicon dioxide.

According to the second exemplary embodiment, a cavity is formed notjust immediately underneath the interconnect but an entire planeunderneath the interconnect is defined as a cavity, thus resulting inthe optimum dielectric constant of k=1 for all parasitic substratecapacitances.

In the description of the following second exemplary embodiment, inwhich the interconnects are supported from underneath (the supportpasses through from the mount substrate and virtually the entire planebelow the interconnect plane is defined as a cavity), the same referencesymbols denote identical or similar layers and elements as in FIGS. 1 to5, so that they will not be described again in the following text.

As shown in FIGS. 6A to 6C, a supporting structure 10 for a subsequentinterconnect is formed on the mount substrate 1 according to the secondexemplary embodiment. For example, dielectric supporting elements arearranged in the form of strips or lines on the surface of the mountsubstrate 1, and are covered with a sacrificial layer 2. The dielectricsupporting structure is produced by deposition of a non-porous SiO₂layer that is subsequently structured. In this case, anisotropic dryetching processes can be used for structuring, although wet etchingprocesses can also be used. As an alternative to the SiO₂ material beingused for the dielectric supporting structure 10, it is also possible touse low-k materials (materials whose dielectric constant k isconsiderably less than that of silicon dioxide). The k value of thedielectric constant of silicon dioxide is about 3.9, and is used as areference value for classification of low-k and high-k materials.

Although the materials mentioned above, such as temperature-resistantpolyimide, may be used for the sacrificial layer 2, Si₃N₄ canalternatively be used for the supporting structure 10 as well. SiO₂ canbe used for the sacrificial layer 2, with RF etching being carried outin a subsequent removal step to remove the sacrificial layer 2. SinceSi₃N₄ and SiO₂ are available in every standard process, this results ina simple implementation. The second exemplary embodiment will also bedescribed in the following text for a polymer of the sacrificial layer 2and for SiO₂ as the supporting structure 10.

As shown in FIGS. 7A to 7C, the sacrificial layer 2 is planarized toexpose a surface of the supporting structure 10. The polymer 2 may bepolished back to the upper edge of the supporting structure 10 by meansof a CMP method. Furthermore, any contact openings O are formed at thistime, as in the exemplary embodiment 1 by etching of the sacrificiallayer 2 as far as the mount substrate 1.

As shown in FIGS. 8A to 8C, an interconnect layer 4, possibly with anoptional barrier layer 3, is now once again formed on the planarizedsurface (on the surface of the sacrificial layer 2 and of the supportingstructure 10). In this case, a contact via V or else a dummy contact viacan once again be provided within the contact opening O as in the firstexemplary embodiment. The contact vias V allow electrical contact withthe mount substrate 1, while no electrical contact is produced in thedummy contact vias, for example because of an insulating base layer(which is not illustrated) between the interconnect 4 and the mountsubstrate 1. Once again, either the CVD methods described above fordeposition of tungsten or the PVD/electrochemical method mentioned aboveis carried out, in which a copper plug is formed electrochemically inthe contact via, with an aluminum layer being deposited above this bymeans of a sputtering method. The temperature requirements for thesacrificial layer 2 are correspondingly different for the exemplaryembodiment 1.

Furthermore, as shown in FIGS. 8A to 8C, the interconnect layer thatcomprises, for example, the tungsten layer 4 and the barrier layer 3 isalso structured, thus resulting in the normal interconnects in the formof straight lines and strips. When using a supporting structure in theform of straight lines and strips, the interconnects may be arrangedessentially at right angles to the supporting structure 10, thus makingit possible to produce a very simple design. However, the supportingstructures can also be arranged at any desired angle to theinterconnects.

As in the case of the first exemplary embodiment, as an alternative tothe subtractive structuring processes described above for production ofthe structured interconnects by means of photoresistive lacquer,exposure and subsequent etching, the interconnects can also be formed bymeans of a damascene or dual-damascene process. In this case, as shownin FIGS. 7A to 7C after the planarization, an SiO₂ layer is once againformed on the surface of the sacrificial layer 2, with the subsequentinterconnect lines being produced by means of trenches in this SiO₂layer. As in the first exemplary embodiment, thin barrier and seedlayers can once again be deposited by means of a PVD method, with acopper layer being deposited on this by means of an ECD method, andbeing planarized by means of a CMP method.

As is illustrated in FIGS. 8A and 8B, the sacrificial layer 2 may remaincomplete, for example, during this etching process. However, it can alsobe partially removed, as in FIG. 3B.

As shown in FIGS. 9A to 9C, the sacrificial layer 2 is then completelyremoved to form a cavity 6, which is virtually complete except for thesupporting elements 10 and covers at least the entire plane underneaththe interconnect or interconnects 3, 4. As in the case of the firstexemplary embodiment, thermal conversion can once again be carried out,with the polymer being chemically converted or burnt away attemperatures of 300 to 600 degrees Celsius. Once again, a residualdecomposition layer 7 can also be formed on the surface of the mountsubstrate 1, if desired as a further barrier layer to prevent materialsfrom diffusing from the interconnect into the semiconductor material.

The open arrangement in the second exemplary embodiment means that, asan alternative to this thermal conversion or to the use of thealternatively described oxygen or hydrogen plasmas, it is also possibleto use conventional isotropic etching processes such as an RF wetetching process, in which case Si₃N₄ can also be used as the supportingstructure 10 and SiO₂ as the sacrificial layer 2. The materials for thebarrier layer 3 and the actual interconnect layer 4 can be chosenappropriately such that no on-etching is carried out during this removalof the sacrificial layer 2. Furthermore, isotropic plasma etching canalternatively be carried out, by which means the sacrificial layer 2 iscompletely removed. In consequence, the interconnects are supported orborne from underneath only by the supporting structure 10 and, possibly,by the contact vias V or optional dummy contact vias.

As shown in FIGS. 10A and 10B, a closed dielectric covering layer 5B isformed above the interconnect 3, 4 in a final step. In this case, anon-porous dielectric (for example SiO₂) may be depositednon-conformally such that the gaps between the interconnects or bitlines are completely closed, and a flat plane can be produced for asubsequent layer structure. For a non-conformal deposition method suchas this, the interconnects are only partially covered by dielectric ontheir side surfaces, so that a side cavity 6A can also be produced in anadvantageous manner between adjacent interconnects.

In this second exemplary embodiment, this results in the greatestpossible reduction in the parasitic capacitances both with respect tothe mount substrate 1 and with respect to adjacent interconnects, sincenot only does the entire plane below the-interconnects contain a cavity6, and is thus filled with air or a non-conductive gas or a vacuum, buta cavity 6A with an optimum k value of k=1 is also produced, at leastpartially, at the side alongside the interconnects. In conjunction withthe non-conformal covering layer 5B, that is to say the layer with adifferent layer thickness, the supporting structure 10 and the contactvias V are sufficiently mechanically robust to allow furthermetallization levels in subsequent layers.

FIG. 11 shows a simplified plan view of an interconnect arrangementaccording to a third exemplary embodiment in which the supportingstructure is essentially in the form of islands. In this case,rectangular supporting elements 10A project beyond the interconnectwidth at the sides or, as square supporting elements 10B, also have anarrower width than the interconnect width. This embodiment results in afurther slight improvement in the parasitic capacitances.

This results in an interconnect arrangement in which the parasiticcapacitances have been reduced to the greatest possible extent, with acavity being formed at least immediately underneath the interconnect orbetween the interconnect and the mount substrate. This cavity can run inthe form of a tunnel just underneath the interconnects, or can occupythe entire plane underneath the interconnects, or may even extendlaterally between the interconnects.

For example, when using an interconnect arrangement such as this as abit line in a semiconductor memory cell as shown in FIG. 12, the storagecapacitors CS shown in this figure can be considerably reduced, and theelectrical characteristics, such as the read speeds, can be considerablyincreased.

The invention has been explained above with reference to selectedmaterials. However, it is not restricted to these materials and in thesame way also covers other alternative materials which are used forproduction of the cavities in conjunction with the holding andsupporting elements. Furthermore, combinations of the exemplaryembodiments mentioned above are also possible, with the use of porousmaterials for the covering layer 5B also being mentioned. In the sameway, the present invention is not restricted just to interconnectarrangements in the field of semiconductor technology, but in the sameway covers all other interconnect and conductor track arrangements, forexample in printed circuits etc., in which the electricalcharacteristics of the interconnects and conductor tracks and theparasitic capacitances are important.

It is therefore intended that the foregoing detailed description beregarded as illustrative rather than limiting, and that it be understoodthat it is the following claims, including all equivalents, that areintended to define the spirit and scope of this invention. Nor isanything in the foregoing description intended to disavow scope of theinvention as claimed or any equivalents thereof.

1. An interconnect arrangement comprising: an electrically conductivemount substrate; a dielectric layer formed on the mount substrate; andan electrically conductive interconnect formed on the dielectric layer,wherein at least a portion of the dielectric layer under theinterconnect contains a cavity.
 2. The interconnect arrangement of claim1, further comprising a porous dielectric layer that adheres to theinterconnect and bounds the cavity.
 3. The interconnect arrangement ofclaim 1, wherein the interconnect comprises a contact via that leadsfrom the interconnect to a surface of the substrate and electricallyconnects to the substrate.
 4. The interconnect arrangement of claim 1,wherein the interconnect comprises a dummy contact via that leads fromthe interconnect to a surface of the substrate and does not electricallyconnect to the substrate.
 5. The interconnect arrangement of claim 1,wherein the interconnect comprises a barrier layer that preventsinterconnect material from diffusing into the mount substrate.
 6. Theinterconnect arrangement of claim 1, further comprising a residualdecomposition layer formed in the cavity on a surface of the mountsubstrate.
 7. An interconnect arrangement comprising: an electricallyconductive mount substrate; a dielectric layer formed on the mountsubstrate; an electrically conductive interconnect formed on thedielectric layer, at least a portion of the dielectric layer under theinterconnect contains a cavity; and dielectric supporting elementsformed in the cavity on a surface of the mount substrate, the dielectricsupporting elements support the interconnect.
 8. The interconnectarrangement of claim 7, further comprising a non-porous dielectriccovering layer formed on the interconnect such that the cavity is alsolocated to a side of the interconnect.
 9. The interconnect arrangementof claim 7, wherein the supporting elements are formed in a straightline and essentially at right angles to the interconnect.
 10. Theinterconnect arrangement of claim 7, wherein the supporting elementscomprise islands.
 11. A method for production of an interconnectarrangement, the method comprising: a) forming a sacrificial layer on anelectrically conductive mount substrate; b) forming an interconnectlayer on the sacrificial layer; c) structuring the interconnect layerand the sacrificial layer to produce a structured interconnect on thestructured sacrificial layer; d) forming a porous dielectric layer on asurface of the mount substrate and of the structured interconnect aswell as the sacrificial layer; and e) removing the sacrificial layer toform a cavity under the interconnect.
 12. The method of claim 11,wherein, in a), an opening for a contact via or a dummy contact via isformed in the sacrificial layer.
 13. The method of claim 11, wherein, ina) to c), a damascene or dual damascene process is carried out.
 14. Themethod of claim 11, wherein, in e) thermal conversion of the sacrificiallayer is carried out in a temperature range from 300 to 600 degreesCelsius, with the gaseous decomposition products escaping through theporous layer.
 15. The method of claim 11, wherein, in e), a residualdecomposition layer is formed on the surface of the mount substrate. 16.A method for production of an interconnect arrangement, the methodcomprising: a) forming a supporting structure on a mount substrate; b)forming a sacrificial layer on a surface of the mount substrate and ofthe supporting structure; c) planarizing the sacrificial layer to exposethe surface of the supporting structure; d) forming an interconnectlayer on the surface of the sacrificial layer and of the supportingstructure; e) structuring the interconnect layer to produce a structuredinterconnect; f) removing the sacrificial layer to form a cavity atleast under the interconnect; and g) forming a closed dielectriccovering layer above the interconnect.
 17. The method of claim 17,wherein, after e), an opening for a contact via or a dummy contact viais formed in the sacrificial layer.
 18. The method of claim 17, wherein,in f), thermal conversion of the sacrificial layer is carried out in atemperature range from 300 to 600 degrees Celsius.
 19. The method ofclaim 17, wherein, in f), a residual decomposition layer is formed onthe surface of the mount substrate.
 20. The method of claim 17, wherein,in a), the supporting structure is formed in a linear form or likeislands.
 21. An interconnect arrangement comprising: an electricallyconductive mount substrate; means for insulating the mount substrate, atleast a portion of the means comprising a cavity; and means forelectrically interconnecting elements formed on the insulating means.22. The interconnect arrangement of claim 21, further comprising porousmeans for bounding the cavity.
 23. The interconnect arrangement of claim21, wherein the interconnect means comprises barrier means forpreventing interconnect material from diffusing into the mount substrateduring fabrication.
 24. The interconnect arrangement of claim 21,further comprising residual decomposition means for permitting gaseousdecomposition products created during fabrication to escape from theinterconnect arrangement.
 25. The interconnect arrangement of claim 21,further comprising support means for supporting the interconnect means.